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3306B 160G0 S849TR CM1888 4HC40 LTC1597 HCT1G LC66562A
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          usa 858 674 8100 ? ? germany 49 7032 7806 0 ? ? singapore 65 6287 8998 ? ? shanghai 86 21 54643211 / 2 ? ? china 86 755 33966678 ? ? taiwan 886 3 4641811 www.pulseeng.com 28 spm2006 (7/07) smt power inductors shielded drum core - pg0085/pg0086 series    
 
 
   
   
      
          
   
 mechanical schematic electrical specifications @ 25c ? operating temperature -40c to +130c 1 dimensions: inches mm unless otherwise specified, all tolerances are .004 0,10                        
 
   
  
   
    
 height: 1.8mm max footprint: 4.3mm x 4.3mm max current rating: up to 1.5a inductance range: 0.7h to 3500h  weight . . . . . . . . . . .0.1 grams tape & reel . . . . . . .2850/reel part 7 inductance inductance irated 5 dcr ( ) saturation 6 heating 7 core loss 8 srf number @0a dc @irated (a) current i sat current i dc factor (mhz) ( h 20%) ( h typ) typ max -40% (a) +40c (a) (k2) pg0085 s eries pg0085.102 1.0 0.7 1.50 0.026 0.033 1.50 3.00 1300 >40 pg0085.152 1.5 1.0 1.30 0.033 0.038 1.30 2.60 1500 >40 pg0085.222 2.2 1.5 1.10 0.038 0.046 1.10 2.20 1900 >40 pg0085.332 3.3 2.3 1.00 0.060 0.077 1.00 2.00 2200 >40 pg0085.472 4.7 3.3 0.86 0.080 0.100 0.86 1.60 2800 >40 pg0085.682 6.8 4.8 0.66 0.093 0.115 0.66 1.30 3300 38 pg0085.103 10 7.0 0.55 0.152 0.182 0.55 1.10 3600 29 pg0085.153 15 10.5 0.45 0.207 0.235 0.45 0.90 4800 36 pg0085.223 22 15.4 0.40 0.330 0.360 0.40 0.80 5500 33 pg0085.333 33 23.1 0.30 0.463 0.510 0.30 0.60 7300 16 pg0085.473 47 32.9 0.28 0.655 0.780 0.28 0.55 8200 14 pg0085.683 68 47.6 0.26 0.930 1.200 0.26 0.50 10000 12 pg0085.104 100 70 0.18 1.450 1.750 0.18 0.35 12000 10 pg0085.154 150 105 0.16 1.780 2.000 0.16 0.30 15000 8.0 pg0085.224 220 154 0.13 2.800 3.500 0.13 0.26 18000 6.0 pg0086 s eries pg0086.334 330 231 0.080 4.76 5.40 0.080 0.16 23000 5.0 pg0086.474 470 329 0.072 5.82 6.70 0.072 0.14 28000 4.5 pg0086.604 600 420 0.058 8.00 8.80 0.058 0.12 31000 4.2 pg0086.684 680 476 0.055 8.30 9.00 0.055 0.11 33000 3.7 pg0086.824 820 574 0.050 9.50 10.50 0.050 0.10 36000 3.4 pg0086.105 1000 700 0.045 10.70 11.50 0.045 0.09 40000 3.1 pg0086.155 1500 1005 0.043 20.00 22.00 0.043 0.08 50000 2.6 pg0086.205 2000 1400 0.037 24.00 26.00 0.037 0.07 58000 2.0 pg0086.305 3000 2100 0.034 37.60 41.50 0.034 0.06 47000 1.7 pg0086.505 5000 3500 0.024 58.60 62.80 0.024 0.05 90000 1.3 notes from table: (see page 43) inductance vs current characteristics
usa 858 674 8100 ? ? germany 49 7032 7806 0 ? ? singapore 65 6287 8998 ? ? shanghai 86 21 54643211 / 2 ? ? china 86 755 33966678 ? ? taiwan 886 3 4641811 www.pulseeng.com 43 spm2006 (7/07) smt power inductors shielded drum core series notes from tables (pages 27 - 42) 1. unless otherwise specified, all testing is made at 100khz, 0.1vac. 2. optional tape & reel packaging can be ordered by adding a "t" suffix to the part number (i.e. p1166.102 becomes p1166.102t). pulse complies with industry standard tape and tape & reel specification eia481. 3. to order rohs compliant part, add the suffix " nl " to the part number (i.e. p1166.102 becomes p1166.102 nl and p1166.102t becomes p1166.102 nl t). 4. temperature of the component (ambient plus temperature rise) must be within specified operating temperature range. 5. the rated current (irated) as listed is either the satura- tion current or the heating current depending on which value is lower. 6. the saturation current, isat, is the current at which the component inductance drops by the indicated percentage (typical) at an ambient temperature of 25c. this current is determined by placing the component in the specified ambient environment and applying a short duration pulse current (to eliminate self-heating effects) to the component. 7. the heating current, idc, is the dc current required to raise the component temperature by the indicated delta (approximately). the heating current is determined by mounting the component on a typical pcb and applying current for 30 minutes. the temperature is measured by placing the thermocouple on top of the unit under test. 8. in high volt*time (et) or ripple current applications, addi- tional heating in the component can occur due to core losses in the inductor which may necessitate derating the current in order to limit the temperature rise of the component. in order to determine the approximate total loss (or temperature rise) for a given application, both copper losses and core losses should be taken into account. estimated temperature rise: trise = [total loss (mw) / k0] .833 ( o c ) total loss = copper loss + core loss (mw) copper loss = i rms 2 x dcr (typical) (mw) irms = [i dc 2 + i 2 /12] 1/2 (a) core loss = k1 x f (khz) 1.23 x bac(ga) 2.38 (mw) bac (peak to peak flux density) = k2 x i (ga) [= k2/l(h) x et(v-sec) (ga)] where f varies between 25khz and 1mhz, and bac is less than 2500 gauss. k2 is a core size and winding dependant value and is given for each p/n in the proceeding datasheets. k0 & k1 are platform and material dependant constants and are given in the table below for each platform. pg0085/86 2.3 5.29e-10 pg0087 5.8 15.2e-10 pg0040/41 0.8 2.80e-10 p1174 0.8 6.47e-10 pf0601 4.6 14.0e-10 pf0464 3.6 24.7e-10 pf0465 3.6 33.4e-10 p1166 1.9 29.6e-10 p1167 2.1 42.2e-10 pf0560nl 5.5 136e-10 p1168/69 4.8 184e-10 p1170/71 4.3 201e-10 p1172/73 5.6 411e-10 pf0552nl 8.3 201e-10 pf0553nl 7.1 411e-10 part no. trise factor core loss factor (k0 ) (k1) take note that the component's temperature rise varies depending on the system condition. it is suggested that the component be tested at the system level, to verify the temperature rise of the component during system operation. "#("**2 *3%14(-*&+5                $1**        !"#$% & "#("**2 !6 ' ' '
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